New details on Sony‘s newly-released PS5 model CFI-1202 have surfaced on angstromonics, offering a comparison between the console’s TSMC N6, otherwise known as Oberon Plus, and the standard 7nm Oberon.
In case you missed it, the PS5 model CFI-1202 features reduced power consumption while still offering the same performance as the standard model. This has been accomplished by porting the PS5 silicon to TSMC N6 by AMD’s Semi-Custom design force.
As TSMC completes its transition to increase EUV adoption and move most products to N6 from N7, we get updates like Oberon Plus. While most fabless companies would just design a new product on N6, game consoles demand absolute low-level platform hardware and software compatibility.
The comparison between the 6nm Oberon Plus to the 7nm Oberon reveals that die size has been reduced from ~300 mm² to below 260 mm². Thanks to these reductions and lighter cooler offered by lower power consumption, the site estimates that Sony is able to reduce manufacturing costs by as much as 12%.
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Last month, a teardown of the PS5 CFI-1200 by YouTuber Austin Evans revealed that the console had “surprisingly different’ innards to the previous iterations of the console.
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